Tungsten core wire (for semiconductor production diamond wire)
Tungsten core wire is the core wire for next-generation semiconductor production diamond multi-wire saws.
(Product Introduction) ●Full Name: Tungsten Core Wire (for Diamond Multi-Wire) ●Category: Cutting Tools ●Usage: Core wire for diamond multi-wire saws ●Application: Multi-slicing of hard and brittle materials such as silicon, sapphire, neodymium iron magnets, SiC, GaN, etc. ●Features: Compared to the current high carbon steel core wire (standard: 35μm is the limit), tungsten (standard: 25μm and above) allows for high-tensile, thin-diameter multi-slicing cutting, and the cutting surface is a beautiful mirror finish. Product Specifications) Abbreviations: W = Tungsten, Re = Rhenium, S = Sample available ●Specifications: Tungsten diameter: 25, 30, 35, 40μm ●Model Numbers: W25, W30, W35, W40 ●Packaging: Standard length of 100 km (can be wound in lengths of 1 km to 200 km to match the user's reel shape) ●Weight of 100 km roll: W25: 10 kg, W30: 15 kg, W35: 20 kg, W40: 25 kg (net weight: reel weight is separate)
- Company:アソシエイト トレーディング 土屋 裕 v09018951120 qq3508274141 ttt@zd.wakwak.com
- Price:100,000 yen-500,000 yen